Bismaleimides

Compimide® Bismaleimides


High-performance materials helping you to meet your future requirements for advanced composites today.


Evonik offers more than 30 years of experience in the field of bismaleimide resins. Our products are certified and referenced throughout the industry.


The Compimide® Bismaleimide resin family represents a full range of proprietary thermosetting resins and specialities developed for the production of high-performance composites, adhesives and moldings. Compimide® Bismaleimide matrix resins can be characterized by their high glass transition temperature (Tg). They offer improved high temperature performance over epoxies and cyanate esters. Other outstanding features are:

  • Easy processing by autoclave, platen press, and compression molding techniques

  • Retention of excellent mechanical properties up to 250 °C

  • Good solvent resistance

  • Excellent performance in hot / wet conditions

  • Superior flame and radiation resistance, low smoke and toxicant emissions

 

Typical processing techniques include prepregging (from the melt, solution, or suspension), resin transfer molding (RTM), filament winding, compression molding, powder coating, and pultrusion.

The Compimide® Bismaleimide product group comprises Compimide® Bismaleimide monomers, toughening modifiers and formulated bismaleimide resins.

Compimide Bismaleimide Monomers as the main ingredients for various bismaleimide resins:

Compimide® Bismaleimide Monomers

Product

IUPAC Name

CAS No.

EINECS No.

TSCA

ENCS No.

Compimide

MDAB

4,4’-bismaleimidodiphenylmethane

13676-54-5

237-163-4

yes

5-3377

Compimide

TDAB

2,4-bismaleimidotoluene

6422-83-9

229-175-3

yes

5-3373

 

Compimide® Toughening Modifiers have been designed for use with Compimide® Bismaleimide Monomers especially to enhance the processing as well as toughness of cured Composites:

Compimide® Toughening Modifiers

Product

IUPAC Name

CAS No.

EINECS No.

TSCA

ENCS No.

Compimide

TM123

4,4’-bis(o-propenylphenoxy)-benzophenone

109423-33-8

n/a

yes

n/a

Compimide

TM124

2,2’-bis(3-allyl-4-hydroxyphenyl)-propane

1745-89-7

217-121-1

yes

4-1587

Compimide® Formulated Bismaleimides Resins: The proprietary Compimide® Formulated Bismaleimide systems have been tailored for use in several different processing techniques. The incorporation of monomers, toughening modifiers as well as preparation know-how ensures the unique performance of the final composite. Compimide® Formulated Bismaleimide systems are available as a resolidified melt, as a powder, or as a solution.

Compimide® Formulated Bismaleimide Resins

Product

Type

Compimide

353 A

eutectic mixture of BMI building blocks supplied as a resolidified melt

Compimide

796

advanced bismaleimide resin supplied as a resolidified melt

Compimide

P500

low-melting toughened bismaleimide powder resin

Compimide

200

heat-curable bismaleimide resin supplied as a powder

Compimide

1206R55

formulated resin solution for the manufacture of printed wiring boards (PWB)

Compimide

1224 L60

toughened formulation supplied as resin solution for the manufacture of PWB

Compimide

1251RH60

formulated resin solution (BMI / epoxy blend) for the manufacture of PWB

Compimide

353RTM

designed for the Resin Transfer molding (RTM) process

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