High-performance materials helping you to meet your future requirements for advanced composites today.
Evonik offers more than 30 years of experience in the field of bismaleimide resins.
Our products are certified and referenced throughout the industry.
The Compimide® Bismaleimide resin family represents a full range of proprietary thermosetting resins and specialities developed for the production of high-performance composites, adhesives and moldings. Compimide® Bismaleimide matrix resins can be characterized by their high glass transition temperature (Tg). They offer improved high temperature performance over epoxies and cyanate esters. Other outstanding features are:
Easy processing by autoclave, platen press, and compression molding techniques
Retention of excellent mechanical properties up to 250 °C
Good solvent resistance
Excellent performance in hot / wet conditions
Superior flame and radiation resistance, low smoke and toxicant emissions
Typical processing techniques include prepregging (from the melt, solution, or suspension), resin transfer molding (RTM), filament winding, compression molding, powder coating, and pultrusion.
The Compimide® Bismaleimide product group comprises Compimide® Bismaleimide monomers, toughening modifiers and formulated bismaleimide resins.
Compimide Bismaleimide Monomers as the main ingredients for various bismaleimide resins:
Compimide® Toughening Modifiers have been designed for use with Compimide® Bismaleimide Monomers especially to enhance the processing as well as toughness of cured Composites:
Compimide® Formulated Bismaleimides Resins: The proprietary Compimide® Formulated Bismaleimide systems have been tailored for use in several different processing techniques. The incorporation of monomers, toughening modifiers as well as preparation know-how ensures the unique performance of the final composite. Compimide® Formulated Bismaleimide systems are available as a resolidified melt, as a powder, or as a solution.
eutectic mixture of BMI building blocks supplied as a resolidified melt
advanced bismaleimide resin supplied as a resolidified melt
low-melting toughened bismaleimide powder resin
heat-curable bismaleimide resin supplied as a powder
formulated resin solution for the manufacture of printed wiring boards (PWB)
toughened formulation supplied as resin solution for the manufacture of PWB
formulated resin solution (BMI / epoxy blend) for the manufacture of PWB
designed for the Resin Transfer molding (RTM) process