COMPIMIDE® bismaleimides resins

High-performance materials helping you to meet your future requirements for advanced composites today

Evonik offers more than 30 years of experience in the field of bismaleimide resins. Our products are certified and referenced throughout the industry. The Compimide® Bismaleimide resin family represents a full range of proprietary thermosetting resins and specialities developed for the production of high-performance composites, adhesives and moldings. Compimide® Bismaleimide matrix resins can be characterized by their high glass transition temperature (Tg). They offer improved high temperature performance over epoxies and cyanate esters. Other outstanding features are:

  • Easy processing by autoclave, platen press, and compression molding techniques
  • Retention of excellent mechanical properties up to 250 °C
  • Good solvent resistance
  • Excellent performance in hot / wet conditions
  • Superior flame and radiation resistance, low smoke and toxicant emissions

Typical processing techniques include prepregging (from the melt, solution, or suspension), resin transfer molding (RTM), filament winding, compression molding, powder coating, and pultrusion.

Compimide® bismaleimide monomers

The Compimide® Bismaleimide product group comprises Compimide® Bismaleimide monomers, toughening modifiers and formulated bismaleimide resins. Compimide Bismaleimide Monomers as the main ingredients for various bismaleimide resins:

Product
IUPAC name
CAS no.
EINECS no.
TSCA
ENCS no.
Compimide®
MDAB
4,4’-bismaleimidodiphenylmethane
13676-54-5
237-163-4
yes
5-3377
Compimide®
TDAB
2,4-bismaleimidotoluene
6422-83-9
229-175-3
yes
5-3373

Compimide® toughening modifiers

Compimide® Toughening Modifiers have been designed for use with Compimide® Bismaleimide Monomers especially to enhance the processing as well as toughness of cured Composites:

Product
IUPAC name
CAS no.
EINECS no.
TSCA
ENCS no.
Compimide® 
TM123
4,4’-bis(o-propenylphenoxy)-benzophenone
109423-33-8
n/a
yes
n/a
Compimide®
TM 124 
2,2’-bis(3-allyl-4-hydroxyphenyl)-propane
1745-89-7
217-121-1
yes
4-1587

Compimide® formulated bismaleimide resins

Compimide® Formulated Bismaleimides Resins: The proprietary Compimide® Formulated Bismaleimide systems have been tailored for use in several different processing techniques. The incorporation of monomers, toughening modifiers as well as preparation know-how ensures the unique performance of the final composite. Compimide® Formulated Bismaleimide systems are available as a resolidified melt, as a powder, or as a solution.

Product
Type
Compimide® 
353 A
Eutectic mixture of BMI building blocks supplied as a resolidified melt
Compimide®
796 
Advanced bismaleimide resin supplied as a resolidified melt
Compimide® 
P500
Low-melting toughened bismaleimide powder resin
Compimide®
200 
Heat-curable bismaleimide resin supplied as a powder
Compimide® 
1206R55
Formulated resin solution for the manufacture of printed wiring boards (PWB)
Compimide® 
1224L60
Toughened formulation supplied as resin solution for the manufacture of PWB
Compimide®
1251RH60 
Formulated resin solution (BMI / epoxy blend) for the manufacture of PWB
Compimide®
353RTM 
Designed for the Resin Transfer molding (RTM) process

OTHER TECHNOLOGICAL CAPABILITIES

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