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API contract manufacturing organization - Bismaleimide resins

COMPIMIDE® bismaleimides resins

High-performance materials helping you to meet your future requirements for advanced composites today

Evonik offers more than 30 years of experience in the field of bismaleimide resins. Our products are certified and referenced throughout the industry. The Compimide® Bismaleimide resin family represents a full range of proprietary thermosetting resins and specialities developed for the production of high-performance composites, adhesives and moldings. Compimide® Bismaleimide matrix resins can be characterized by their high glass transition temperature (Tg). They offer improved high temperature performance over epoxies and cyanate esters. Other outstanding features are:

  • Easy processing by autoclave, platen press, and compression molding techniques

  • Retention of excellent mechanical properties up to 250 °C

  • Good solvent resistance

  • Excellent performance in hot / wet conditions

  • Superior flame and radiation resistance, low smoke and toxicant emissions

Typical processing techniques include prepregging (from the melt, solution, or suspension), resin transfer molding (RTM), filament winding, compression molding, powder coating, and pultrusion.

Compimide® bismaleimide monomers

The Compimide® Bismaleimide product group comprises Compimide® Bismaleimide monomers, toughening modifiers and formulated bismaleimide resins. Compimide Bismaleimide Monomers as the main ingredients for various bismaleimide resins:

Product

IUPAC name

CAS no.

EINECS no.

TSCA

ENCS no.

Compimide®
MDAB

4,4’-bismaleimidodiphenylmethane

13676-54-5

237-163-4

yes

5-3377

Compimide®
TDAB

2,4-bismaleimidotoluene

6422-83-9

229-175-3

yes

5-3373

Compimide® toughening modifiers

Compimide® Toughening Modifiers have been designed for use with Compimide® Bismaleimide Monomers especially to enhance the processing as well as toughness of cured Composites:

Product

IUPAC name

CAS no.

EINECS no.

TSCA

ENCS no.

Compimide® 
TM123

4,4’-bis(o-propenylphenoxy)-benzophenone

109423-33-8

n/a

yes

n/a

Compimide®
TM 124 

2,2’-bis(3-allyl-4-hydroxyphenyl)-propane

1745-89-7

217-121-1

yes

4-1587

Compimide® formulated bismaleimide resins

Compimide® Formulated Bismaleimides Resins: The proprietary Compimide® Formulated Bismaleimide systems have been tailored for use in several different processing techniques. The incorporation of monomers, toughening modifiers as well as preparation know-how ensures the unique performance of the final composite. Compimide® Formulated Bismaleimide systems are available as a resolidified melt, as a powder, or as a solution.

Product

Type

Compimide® 
353 A

Eutectic mixture of BMI building blocks supplied as a resolidified melt

Compimide®
796 

Advanced bismaleimide resin supplied as a resolidified melt

Compimide® 
P500

Low-melting toughened bismaleimide powder resin

Compimide®
200 

Heat-curable bismaleimide resin supplied as a powder

Compimide® 
1206R55

Formulated resin solution for the manufacture of printed wiring boards (PWB)

Compimide® 
1224L60

Toughened formulation supplied as resin solution for the manufacture of PWB

Compimide®
1251RH60 

Formulated resin solution (BMI / epoxy blend) for the manufacture of PWB

Compimide®
353RTM 

Designed for the Resin Transfer molding (RTM) process

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API contract manufacturing organization - Bismaleimide resins

Bismaleimide resins

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